Despite the fact that the iPhone 6s and 6s Plus are not yet available at retail, it looks like the industry is already giving us reasons to talk about its sequel, which, to everyone’s lack of surprise, will most likely be known as the iPhone 7.
To be more precise, according to a new report originating from China, Apple’s upcoming SoC – the A10 – will be exclusively built by TSMC using a 16nm manufacturing process, and will employ the InFO architecture we’ve been hearing about since 2014.
More details after the break.
Apple A10: TSMC Exclusive
As some of you already know, the Apple A9 chip used in both the iPhone 6s and the 6s Plus is manufactured by both TSMC and Samsung, while the A8 is exclusively manufactured in TSMC’s plants.
Now, according to a new rumor, the next-gen Apple A10 application processor will be exclusively manufactured by TSMC on a 16 nm manufacturing process, using InFO architecture. InFO stands for “Integrated Fan Out”, and aside from streamlining the manufacturing process and diminishing costs, InFO might also allow the AP to be manufactured on a SiP (System in Package) design.
Sources add that TSMC will start mass producing the A10 chip in March 2016. In the meantime, the company will continue manufacturing last year’s A8 SoC, which is still used in new products like the iPad mini 4 and the Apple TV. The iPhone 7 should be introduced in Q4 2016, and Apple’s supply chain will apparently begin stocking up on components sometime in the second quarter.
We’ll bring you up to speed as we find out more.