Yesterday we’ve talked about what Samsung’s plans may be for the first quarter of 2014, specifically what smartphones we might expect to hit the shelves during the first three months of the year. Those of you who have read our report should remember that the Samsung Galaxy S5 is also rumored to hit the market within this time-frame.
Today we bring you more bits of information concerning Sammy’s next flagship device, and as the title suggests, they have something to do with the handset’s antennas, and the manufacturing process of the device. Join us after the break for the details.
Some Samsung Galaxy S5 Models to Adopt the LDS Antenna Technology?
According to the Korean media, Samsung is planning on implementing the LDS antenna technology in “some” Galaxy S5 models. Now, before we go on with the antennas, we should address the “some” part.
As you would expect, the SGS5 will most likely go on sale in multiple variants. There might be an Exynos 6-equipped model, as well as a variant that will be powered by the new Snapdragon 805 processor. But, that’s not all, because rumor has it that the Galaxy S5 might come in two different looks as well. There have been leaks and rumors indicating that Samsung will launch the handset in two main flavors, one of which will adopt a metal chassis, while the other will deliver a more conservative plastic body.
But getting back to the matter at hand, fresh reports now indicate that “some” of these SGS5 models (I’m guessing the ones coming with a plastic body) will make use of the LDS process to implement antennas (3G, LTE, Wi-Fi and so on). What is this technology? Well, those of you who are very familiar with the Note 3 might already know the answer, but basically, LDS technology is used to mold antennas directly into the rear plate of a smartphone. This results in a thinner device and a more effective manufacturing process.
We should point out that, while the antennas are not molded into the battery cover itself but on the back plate that is to be found in-between the battery cover and the circuit board, according to the source, this method of installing the antennas also makes the device -or at least the antennas- a bit more vulnerable to external damage.
In layman’s terms, if you drop your handset, you might lose your signal, even if the device appears to be OK.
In another school of thought, it is said that the method of molding the antennas within the back plate makes these parts less vulnerable. Daesan Electronics has recently unveiled a similar technology of molding antennas into the chassis, and according to their sayings, the pressed metal prints are less prone to break.
Whatever the case, it looks like “some” Samsung Galaxy S5 models will adopt this type of tech. Any thoughts? Share them below and stay tuned for more.